Intrinsiq Materials has partnered with NovaCentrix to create a high-performance, low cost, copper-clad polyimide achieved without the use of adhesives or time-consuming sputtering. These thin layers cannot be produced by traditional lamination processes.   The new copper-polyimide is fabricated by directly slot die coating Intrinsiq Material’s CI -Ultra Thin Film (UTF) copper-based conductive ink onto polyimide. The film is then post-processed using state-of-the-art NovaCentrix PulseForge phot...